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1 files changed, 102 insertions, 0 deletions
diff --git a/zimagram-digiblade/zimagram-digiblade-job.gbrjob b/zimagram-digiblade/zimagram-digiblade-job.gbrjob
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+{
+ "Header": {
+ "GenerationSoftware": {
+ "Vendor": "KiCad",
+ "Application": "Pcbnew",
+ "Version": "8.0.6"
+ },
+ "CreationDate": "2024-12-11T20:08:10+01:00"
+ },
+ "GeneralSpecs": {
+ "ProjectId": {
+ "Name": "zimagram-digiblade",
+ "GUID": "7a696d61-6772-4616-9d2d-64696769626c",
+ "Revision": "rev?"
+ },
+ "Size": {
+ "X": 482.65,
+ "Y": 44.51
+ },
+ "LayerNumber": 2,
+ "BoardThickness": 2.09,
+ "Finish": "None"
+ },
+ "DesignRules": [
+ {
+ "Layers": "Outer",
+ "PadToPad": 0.2,
+ "PadToTrack": 0.2,
+ "TrackToTrack": 0.2,
+ "TrackToRegion": 0.5,
+ "RegionToRegion": 0.5
+ }
+ ],
+ "FilesAttributes": [
+ {
+ "Path": "zimagram-digiblade-F_Cu.gbr",
+ "FileFunction": "Copper,L1,Top",
+ "FilePolarity": "Positive"
+ },
+ {
+ "Path": "zimagram-digiblade-F_Silkscreen.gbr",
+ "FileFunction": "Legend,Top",
+ "FilePolarity": "Positive"
+ },
+ {
+ "Path": "zimagram-digiblade-F_Mask.gbr",
+ "FileFunction": "SolderMask,Top",
+ "FilePolarity": "Negative"
+ },
+ {
+ "Path": "zimagram-digiblade-Edge_Cuts.gbr",
+ "FileFunction": "Profile",
+ "FilePolarity": "Positive"
+ }
+ ],
+ "MaterialStackup": [
+ {
+ "Type": "Legend",
+ "Name": "Top Silk Screen"
+ },
+ {
+ "Type": "SolderPaste",
+ "Name": "Top Solder Paste"
+ },
+ {
+ "Type": "SolderMask",
+ "Thickness": 0.01,
+ "Name": "Top Solder Mask"
+ },
+ {
+ "Type": "Copper",
+ "Thickness": 0.035,
+ "Name": "F.Cu"
+ },
+ {
+ "Type": "Dielectric",
+ "Color": "R213G213B213",
+ "Thickness": 2.0,
+ "Material": "Al",
+ "Name": "F.Cu/B.Cu",
+ "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
+ },
+ {
+ "Type": "Copper",
+ "Thickness": 0.035,
+ "Name": "B.Cu"
+ },
+ {
+ "Type": "SolderMask",
+ "Thickness": 0.01,
+ "Name": "Bottom Solder Mask"
+ },
+ {
+ "Type": "SolderPaste",
+ "Name": "Bottom Solder Paste"
+ },
+ {
+ "Type": "Legend",
+ "Name": "Bottom Silk Screen"
+ }
+ ]
+}