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{
"Header": {
"GenerationSoftware": {
"Vendor": "KiCad",
"Application": "Pcbnew",
"Version": "8.0.6"
},
"CreationDate": "2024-12-11T20:08:10+01:00"
},
"GeneralSpecs": {
"ProjectId": {
"Name": "zimagram-digiblade",
"GUID": "7a696d61-6772-4616-9d2d-64696769626c",
"Revision": "rev?"
},
"Size": {
"X": 482.65,
"Y": 44.51
},
"LayerNumber": 2,
"BoardThickness": 2.09,
"Finish": "None"
},
"DesignRules": [
{
"Layers": "Outer",
"PadToPad": 0.2,
"PadToTrack": 0.2,
"TrackToTrack": 0.2,
"TrackToRegion": 0.5,
"RegionToRegion": 0.5
}
],
"FilesAttributes": [
{
"Path": "zimagram-digiblade-F_Cu.gbr",
"FileFunction": "Copper,L1,Top",
"FilePolarity": "Positive"
},
{
"Path": "zimagram-digiblade-F_Silkscreen.gbr",
"FileFunction": "Legend,Top",
"FilePolarity": "Positive"
},
{
"Path": "zimagram-digiblade-F_Mask.gbr",
"FileFunction": "SolderMask,Top",
"FilePolarity": "Negative"
},
{
"Path": "zimagram-digiblade-Edge_Cuts.gbr",
"FileFunction": "Profile",
"FilePolarity": "Positive"
}
],
"MaterialStackup": [
{
"Type": "Legend",
"Name": "Top Silk Screen"
},
{
"Type": "SolderPaste",
"Name": "Top Solder Paste"
},
{
"Type": "SolderMask",
"Thickness": 0.01,
"Name": "Top Solder Mask"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "F.Cu"
},
{
"Type": "Dielectric",
"Color": "R213G213B213",
"Thickness": 2.0,
"Material": "Al",
"Name": "F.Cu/B.Cu",
"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "B.Cu"
},
{
"Type": "SolderMask",
"Thickness": 0.01,
"Name": "Bottom Solder Mask"
},
{
"Type": "SolderPaste",
"Name": "Bottom Solder Paste"
},
{
"Type": "Legend",
"Name": "Bottom Silk Screen"
}
]
}
|
